Korea's chip supply chain, company by company
Sixty-five listed Korean companies that build, equip, package, test or supply the semiconductor industry — with the English name, the Korean name you will see in filings, and the KRX ticker you need to look them up. Every one of these is on the watchlist our DART radar monitors, so their regulatory filings appear on this site in English within minutes of publication.
Descriptions are ours. Tickers are KRX codes. Nothing here is investment advice — it is a map.
The world's largest memory maker and Korea's only leading-edge logic foundry. DRAM, NAND, HBM and 3nm-class foundry under one roof.
DRAM and NAND maker; the volume supplier of HBM to Nvidia and the first to ship 16-high HBM4.
Korea's largest pure-play specialty foundry — analog, power and display driver ICs on mature nodes.
SK holding company whose principal asset is its stake in SK hynix.
Low-power memory for IoT and automotive.
Thermo-compression bonders used to stack HBM; the single most HBM-levered equipment name in Korea.
Deposition equipment (CVD/ALD) for memory and foundry; a core Samsung and SK hynix supplier.
ALD and CVD deposition tools; long-running patent litigation history with global peers.
Low-pressure CVD and ALD systems for DRAM capacitor and gate layers.
PECVD and dry-etch equipment for memory.
High-pressure hydrogen annealing — a near-monopoly tool for curing interface defects at advanced nodes.
Dry strip (photoresist removal) equipment; a global top-share position in that niche.
Holding company for PSK; also reflow and descum tools for advanced packaging.
Semiconductor process equipment.
Wet stations, transfer robots and thermal process equipment.
Central chemical supply systems (CCSS) for fabs, plus reflow and cleaning tools.
CMP equipment and slurry, plus wet cleaning systems.
Laser marking, dicing and drilling systems for wafers and packages.
Dispensers and laser-assisted bonding equipment used in advanced packaging.
Fab and display factory automation, material handling systems.
Wafer pattern-defect inspection systems; a rare Korean challenger to KLA.
Appearance and 3D inspection for packages, including HBM stacks.
Overlay metrology for lithography alignment.
Atomic force microscopes — the global leader in AFM metrology.
Wafer test (probe) services, largely for Samsung System LSI.
Burn-in and memory test equipment.
Wafer test handlers and probers for memory.
Probe cards and test interface boards.
Silicone rubber test sockets; a global share leader.
Test pins and sockets — high-margin consumables sold to every major chipmaker.
OSAT specialising in fan-out wafer-level packaging.
OSAT for memory packaging and test; expanding in Vietnam and the US.
Memory module and package substrates, including HBM-adjacent substrates.
Package substrates including FC-BGA for servers and networking.
High-layer-count PCBs for AI accelerators and switches — a direct Nvidia-cycle beneficiary.
FC-BGA substrates and camera modules; the Apple supply chain plus a substrate push.
MLCC, FC-BGA substrates and camera modules.
High-purity etchants, CMP slurry and electrolytes.
Photoresist and process chemicals; one of the few Korean PR makers.
Blankmask and pellicle — the substrate layer of photomask supply, including EUV development.
EUV pellicles and process chillers.
OLED emitting and common-layer materials.
Quartz ware and ceramic parts consumed by etch and deposition chambers.
Silicon electrodes and rings consumed by etch chambers.
SiC-coated focus rings and other high-durability etch consumables.
Cleaning and coating of process-chamber parts — a consumable-like recurring revenue model.
Dry vacuum pumps for process chambers.
Gas scrubbers and process chillers.
Gas scrubbers and chillers; competes directly with Unisem.
Holding company of the Wonik group; gas and equipment subsidiaries.
Refurbished semiconductor equipment and parts.
The largest used semiconductor equipment marketplace in Asia.
Design house in Samsung Foundry's partner programme; ASIC turnkey.
Design house working with Samsung Foundry and global fabless customers.
Memory-subsystem IP — controllers and PHY for LPDDR and DDR.
Video codec IP licensed into SoCs worldwide.
High-speed SerDes interface IP, including UCIe for chiplets.
Automotive infotainment SoCs.
Microcontrollers for appliances and consumer devices.
Auto-focus and haptic driver ICs for smartphone cameras.
EV and ESS batteries; tracked for the AI-datacentre power build-out.
Batteries and electronic materials, including semiconductor process materials.
Security cameras and video analytics; a Hanwha group AI hardware line.
Offshore structures and special steel; tracked for SK group capex read-through.
Silicon Peninsula is a free daily English brief built from Korean-language sources — filings, trade press and earnings calls that rarely reach English the same day.